Qualcomm TEE memory corruption via TA length bypass
CVE-2025-47373 Published on March 2, 2026

Out-of-bounds Write in Automotive
Memory Corruption when accessing buffers with invalid length during TA invocation.

NVD

Vulnerability Analysis

CVE-2025-47373 can be exploited with local system access, and requires small amount of user privileges. This vulnerability is considered to have a low attack complexity. The potential impact of an exploit of this vulnerability is considered to be very high.

Attack Vector:
LOCAL
Attack Complexity:
LOW
Privileges Required:
LOW
User Interaction:
NONE
Scope:
UNCHANGED
Confidentiality Impact:
HIGH
Integrity Impact:
HIGH
Availability Impact:
HIGH

Weakness Type

What is a Memory Corruption Vulnerability?

The software writes data past the end, or before the beginning, of the intended buffer. Typically, this can result in corruption of data, a crash, or code execution. The software may modify an index or perform pointer arithmetic that references a memory location that is outside of the boundaries of the buffer. A subsequent write operation then produces undefined or unexpected results.

CVE-2025-47373 has been classified to as a Memory Corruption vulnerability or weakness.


Products Associated with CVE-2025-47373

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Qualcomm Snapdragon
 

Affected Versions

Qualcomm, Inc. Snapdragon:

Exploit Probability

EPSS
0.01%
Percentile
1.83%

EPSS (Exploit Prediction Scoring System) scores estimate the probability that a vulnerability will be exploited in the wild within the next 30 days. The percentile shows you how this score compares to all other vulnerabilities.