SAP 3D Visual Enterprise Author 9 MEM Crash via Malformed EMF
CVE-2022-41176 Published on October 11, 2022
Due to lack of proper memory management, when a victim opens manipulated Enhanced Metafile (.emf, emf.x3d) file received from untrusted sources in SAP 3D Visual Enterprise Author - version 9, it is possible for the application to crash and becomes temporarily unavailable to the user until restart of the application.
Weakness Type
What is a Buffer Overflow Vulnerability?
The software performs operations on a memory buffer, but it can read from or write to a memory location that is outside of the intended boundary of the buffer.
CVE-2022-41176 has been classified to as a Buffer Overflow vulnerability or weakness.
Products Associated with CVE-2022-41176
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Affected Versions
SAP SE SAP 3D Visual Enterprise Author Version 9 is affected by CVE-2022-41176Exploit Probability
EPSS (Exploit Prediction Scoring System) scores estimate the probability that a vulnerability will be exploited in the wild within the next 30 days. The percentile shows you how this score compares to all other vulnerabilities.